Qualcomm's Snapdragon board

Layers:10L(Micro-vias for anylayer)
Thickness: 1.2mm ±10%
Width/Space:  0.06mm/0.06mm
Surface Treatment:ENIG

Glod finger:Au≥0.76um

Hole structure:

L1-L2 blind hole
L2-L3 blind hole
L3-L4 blind hole
L4-L5 blind hole
L5-L6 blind hole
L6-L7 blind hole
L7-L8 blind hole
L8-L9 blind hole
L9-L10 blind hole