Renesas's 14L(5+4+5) Edge AI SoM board

Layers:14L(5 levels of uvias, and all uvias stacked with burried vias)

Thickness: 1.37mm ±10%

Min Width/Space:  0.075mm/0.075mm

POFV technology

Hole structure:

L1-L2 blind hole(0.075mm)

L2-L3 blind hole(0.075mm)

L3-L4 blind hole(0.075mm)

L4-L5 blind hole(0.075mm)

L5-L6 blind hole(0.075mm)

L6-L9 buried hole(0.20mm,VIPPO & POFV technology)

L9-L10 blind hole(0.075mm)

L10-L11 blind hole(0.075mm)

L11-L12 blind hole(0.075mm)

L12-L13 blind hole(0.075mm)

L13-L14 blind hole(0.075mm)