| Technology (units: mm) | Production | Comments |
| Max. Layer Count | 20L | |
| HDI Stacked Via | 1+N+1,2+N+2,3+N+3, 4+N+4,5+N+5,And Any-layer | |
| Min Laser Via hole size | 0.075 | |
| Min Laser Capture/Target pad | 0.15 | LDD+LDI (DI) |
| Fine line capability ( Line W/S) | 0.030/0.030 | |
| Laser Via Aspect Ratio (dielectric thickness/via diameter) | 0.9 | |
| Copper Fill (HDI standard) | All Layer | |
| Min Base Copper Weight (UL approved) | 1/4 oz | |
| Board Finishes | IMS, OSP. Carbon, ENIG,ENEPIG | New and Low cost |
| OSP thickness (units :um) | 0.2~0.4 | |
| Au/Ni thickness (units :um) | Au min:0.03 Ni min:2.0 | |
| Min Core Thickness | 0.040 | Prepreg 1067 |
| Min Prepreg Thickness | 0.035 | Prepreg 1037/1027 |
| Minimum Via hole size | 0.15 | Drill bit |
| T/H Via Aspect Ratio (PCB thickness/finished hole size) | 6 |
| Technology (units: mm) | Production | Comments |
| NPTH Hole size tolerance | 0.025 | +0.05/‐0 or +0/‐0.05 |
| PTH Hole size tolerance | 0.05 | |
| Minimum Hole Registration | 0.05 | |
| Hole to hole tolerance | 0.05 | the length of board <150mm |
| Hole center to edge tolerance | 0.075 | |
| Fiducial to Fiducial center tolerance | 0.075 | the length of board <150mm |
| Fiducial Mark to edge tolerance | 0.075 | |
| Layer Registration | 0.05 | |
| Outline NC Routing Tolerance | 0.075 | |
| Blind rout dimension /depth /position tolerance | 0.075 | |
| Min board thickness (for 4 layer ) | 0.3 | |
| Min board thickness (for 6 layer ) | 0.35 | |
| Min board thickness (for 8 layer ) | 0.5 | |
| Min board thickness (for 12 layer ) | 0.065 | |
| Min board thickness Tolerance | T>0.4, +/‐10% T 0.4, +/‐0.4mm | |
| Min Impedance Control Tolerance (50ohm nominal) | 8% |
| Technology (units: mm) | Production | Comments |
| Material Suppliers | EMC, Panasonic, NPC,TUC,ITEQ,SY | |
| Min Line Width & Spacing (Plated Layer) | (.040/.040) | Vacuum DES / Vertical DES is developing |
| Min Line Width & Spacing (Inner Layer) | (.040/.040) | Sample can achieve 0.03/0.03mm |
| Min Line Width & Spacing tolerance | +/15% | |
| Solder mask Type | Screen Spray | |
| Solder mask Color | Black, red, blue,green | |
| Minimum Solder Mask Registration | 0.038 | |
| Minimum Solder Mask DAM | 0.05 | |
| Solder Mask thickness | 0.005~0.025 | |
| Minimum Silkscreen Registration | 0.1 | |
| Max Warpage | 0.35% | |
| Low Dk Material | <3.5 | Low Dk material |
| VIP design (Via in pad ) | Yes |
Add: No.1925,Building Haohaijunyue,No. 2092,Shen yan Road,Yantian District,Shenzhen,China
Tel: (+86) 0755 36675819
Fax: (+86) 0755 61662214
E-mail: sales@speboard.com