Technology (units: mm) | Production | Comments |
Max. Layer Count | 20L | |
HDI Stacked Via | 1+N+1,2+N+2,3+N+3, 4+N+4,5+N+5,And Any-layer | |
Min Laser Via hole size | 0.075 | |
Min Laser Capture/Target pad | 0.15 | LDD+LDI (DI) |
Fine line capability ( Line W/S) | 0.030/0.030 | |
Laser Via Aspect Ratio (dielectric thickness/via diameter) | 0.9 | |
Copper Fill (HDI standard) | All Layer | |
Min Base Copper Weight (UL approved) | 1/4 oz | |
Board Finishes | IMS, OSP. Carbon, ENIG,ENEPIG | New and Low cost |
OSP thickness (units :um) | 0.2~0.4 | |
Au/Ni thickness (units :um) | Au min:0.03 Ni min:2.0 | |
Min Core Thickness | 0.040 | Prepreg 1067 |
Min Prepreg Thickness | 0.035 | Prepreg 1037/1027 |
Minimum Via hole size | 0.15 | Drill bit |
T/H Via Aspect Ratio (PCB thickness/finished hole size) | 6 |
Technology (units: mm) | Production | Comments |
NPTH Hole size tolerance | 0.025 | +0.05/‐0 or +0/‐0.05 |
PTH Hole size tolerance | 0.05 | |
Minimum Hole Registration | 0.05 | |
Hole to hole tolerance | 0.05 | the length of board <150mm |
Hole center to edge tolerance | 0.075 | |
Fiducial to Fiducial center tolerance | 0.075 | the length of board <150mm |
Fiducial Mark to edge tolerance | 0.075 | |
Layer Registration | 0.05 | |
Outline NC Routing Tolerance | 0.075 | |
Blind rout dimension /depth /position tolerance | 0.075 | |
Min board thickness (for 4 layer ) | 0.3 | |
Min board thickness (for 6 layer ) | 0.35 | |
Min board thickness (for 8 layer ) | 0.5 | |
Min board thickness (for 12 layer ) | 0.065 | |
Min board thickness Tolerance | T>0.4, +/‐10% T 0.4, +/‐0.4mm | |
Min Impedance Control Tolerance (50ohm nominal) | 8% |
Technology (units: mm) | Production | Comments |
Material Suppliers | EMC, Panasonic, NPC,TUC,ITEQ,SY | |
Min Line Width & Spacing (Plated Layer) | (.040/.040) | Vacuum DES / Vertical DES is developing |
Min Line Width & Spacing (Inner Layer) | (.040/.040) | Sample can achieve 0.03/0.03mm |
Min Line Width & Spacing tolerance | +/15% | |
Solder mask Type | Screen Spray | |
Solder mask Color | Black, red, blue,green | |
Minimum Solder Mask Registration | 0.038 | |
Minimum Solder Mask DAM | 0.05 | |
Solder Mask thickness | 0.005~0.025 | |
Minimum Silkscreen Registration | 0.1 | |
Max Warpage | 0.35% | |
Low Dk Material | <3.5 | Low Dk material |
VIP design (Via in pad ) | Yes |
Add: No.1925,Building Haohaijunyue,No. 2092,Shen yan Road,Yantian District,Shenzhen,China
Tel: (+86) 0755 36675819
Fax: (+86) 0755 61662214
E-mail: sales@speboard.com