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Manufacturing Capability
ITEMProductionComments
Panel Size X*Y(Max)460mm X 610mm
Cu. In Hole Wall8～38 um
Board Thickness0.036-2.5mm
Gold Thickness0.01-0.10 um
Hard Gold Thickness0.05-0.76 um
Min Line Width & Spacing0.05 mm /0.05 mm0.045 mm /0.045 mm
Tolerance For Coverlayer±0.15 mm±0.0762 mm
Min Solder Mask Bridge0.1mm
Silk To PAD Space0.2mm0.15mm
Min. Test PAD0.2mm×0.2mm
Outline Tolerance±0.1mm
ENEPIG≧0.08um