Qualcomm's Snapdragon board

Layers:10L(Micro-vias for anylayer)
Thickness: 1.2mm ±10%
Width/Space:  0.06mm/0.06mm
Surface Treatment:ENIG

Glod finger:Au≥0.76um

Hole structure:

L1-L2 blind hole
L2-L3 buried hole
L3-L4 buried hole
L4-L5 buried hole
L5-L6 buried hole
L6-L7 buried hole
L7-L8 buried hole
L8-L9 buried hole
L9-L10 buried hole