Qualcomm's Snapdragon board

Layers:12L(4+4+4)

Thickness: 1.2mm ±10%

Min Width/Space:  0.054mm/0.056mm

Surface Treatment:ENIG
Glod finger:Au≥0.76um

Hole structure:

L1-L2 blind hole

L2-L3 buried hole

L3-L4 buried hole

L4-L5 buried hole

L5-L9 buried hole

L8-L9 buried hole

L9-L10 buried hole

L10-L11 buried hole

L11-L12 blind hole

L1-L12 PTH hole